High Reliability with Strong Vibration Resistance

SMT processing is used in chip components, devices with high reliability, small and light, so the anti-vibration ability, automated production.

Mount high reliability, general bad solder rate is less than ten ppm, bitung hole components of wave soldering technology is an order of magnitude lower, to ensure the electronic products or components solder defect rate is low, currently has almost 90% of electronic products by SMT technology.



Electronic Products Are Small in Size & High Assembly Density

1/10 SMT patch element volume only traditional cartridge elements, while the weight is only 10% of the traditional inserting element, usually using SMT technology 40%~60% can reduce the volume of electronic products, reduce the quality of 60%~80%, the area and weight are greatly reduced.

The SMT patch processing component grid from 1.27 MM development to the current 0.63 MM grid, an individual 0.5 MM grid is achieved, through the hole installation technology, installation components, which can make the assembly density higher.

High-frequency Characteristics and Reliable Performance

Because the chip component is firmly installed, the device is usually without lead or short lead, which reduces the influence of parasitic inductance and parasitic capacitance, improves the high-frequency characteristics of the circuit, and reduces electromagnetic and radio frequency interference.

The circuit designed by SMC and SMD has the highest frequency of 3 GHz, while the chip element is the only 500 MHz, which can shorten the transmission delay time. Circuit for clock frequency over 16 MHz. If the MCM technology is used, the high-end clock frequency of the computer workstation can be up to 100 MHz.

And the additional power consumption caused by parasitic reactance can be reduced by 2-3 times.

Improve Productivity and Automate Production

The perforated PCB mounting to realize full automation, also need to expand the original 40% PCB area, so as to make the plug inserting elements automatic plug-in, otherwise, there is no space gap enough, will touch the bad parts.

The automatic placement machine adopts vacuum nozzle suction and discharge components.

The vacuum suction nozzle is smaller than the component shape but improves the installation density.

In fact, small components and fine pitch QFP devices are produced by automatic placement machines to automate production across the board.

SMT Cost Down

(1) The use area of a printed circuit board is reduced, and the area is 1/12 of through-hole technology. If the CSP is installed, the area will be greatly reduced;

(2) The SMT can reduce the number of drilling holes on the printed board and save the repair cost;

(3) Cost down of circuit debugging due to the improvement of frequency characteristics;

(4) Because of the small size and lightweight of the chip components, the cost of packaging, transportation, and storage is reduced;

SMT chip processing technology can save material, energy, equipment, manpower, time, and so on, and can reduce the cost by 30%~50%.

Full Automatic Press

Printing accuracy + 0.025 mm

Repeatability accuracy + 0.01 mm

Minimum steel mesh size 470*380 mm

Maximum steel mesh size 737*737 mm

Platform tuning range X: + 4 mm, Y: + 6 mm

The adjustment angle of the platform is 2 degrees

The minimum size of veneer 50*50 mm

The maximum size of single-board 610*600 mm

PCB thickness 0.4-5 mm

PCB weight 0-3 kg

Solder paste inspection comes with a 2 D online inspection

Squeegee pressure 1-10 KG

FUJI placement machine

Swivel head, 12 suction nozzles

Minimum mount 01005

Patch PCB thickness 0.3-6.5 mm

Patch max size PCB 686*508 mm

Minimum size PCB 50*100 mm

The soft board can be affixed with rigid board

Paste BGA minimum package 0.4 mm

Patch accuracy is minimum, normal component accuracy is + 0.04 mm, IC class, patch accuracy is + 0.03 mm

Mount speed 25000 points/hour

Throw Rate

1, Resistance or capacitance class component is 0.3% (batch index).

2, The IC class device is without throwing material.

Reflow Oven

10 temperature zone reflux furnace in the warm zone

Over the PCBA plate, the maximum size is unlimited, width 50-420mm

The range of temperature control – room temperature – 300 degrees

Temperature control accuracy + 1%

PCB plate temperature distribution deviation is + 1.5 degrees

Parameter reserve 80G

Conveying speed of reflow furnace 300-2000 mm/min

The cooling method, air cooling

Auxiliary equipped with self-heating furnace test system + furnace temperature tester

PCB board element height is 15 mm/ below 50 mm

Check resolution 20

Please contact us for more details if you need, or visit our HIEDESIGN for our design and services.