High Reliability with Strong Vibration Resistance
SMT processing is used in chip components, devices with high reliability, small and light, so the anti-vibration ability, automated production.
Mount high reliability, general bad solder rate is less than ten ppm, bitung hole components of wave soldering technology is an order of magnitude lower, to ensure the electronic products or components solder defect rate is low, currently has almost 90% of electronic products by SMT technology.
Electronic Products Are Small in Size & High Assembly Density
1/10 SMT patch element volume only traditional cartridge elements, while the weight is only 10% of the traditional inserting element, usually using SMT technology 40%~60% can reduce the volume of electronic products, reduce the quality of 60%~80%, the area and weight are greatly reduced.
The SMT patch processing component grid from 1.27 MM development to the current 0.63 MM grid, an individual 0.5 MM grid is achieved, through the hole installation technology, installation components, which can make the assembly density higher.
High-frequency Characteristics and Reliable Performance
Because the chip component is firmly installed, the device is usually without lead or short lead, which reduces the influence of parasitic inductance and parasitic capacitance, improves the high-frequency characteristics of the circuit, and reduces electromagnetic and radio frequency interference.
The circuit designed by SMC and SMD has the highest frequency of 3 GHz, while the chip element is the only 500 MHz, which can shorten the transmission delay time. Circuit for clock frequency over 16 MHz. If the MCM technology is used, the high-end clock frequency of the computer workstation can be up to 100 MHz.
And the additional power consumption caused by parasitic reactance can be reduced by 2-3 times.
Improve Productivity and Automate Production
The perforated PCB mounting to realize full automation, also need to expand the original 40% PCB area, so as to make the plug inserting elements automatic plug-in, otherwise, there is no space gap enough, will touch the bad parts.
The automatic placement machine adopts vacuum nozzle suction and discharge components.
The vacuum suction nozzle is smaller than the component shape but improves the installation density.
In fact, small components and fine pitch QFP devices are produced by automatic placement machines to automate production across the board.
SMT Cost Down
(1) The use area of a printed circuit board is reduced, and the area is 1/12 of through-hole technology. If the CSP is installed, the area will be greatly reduced;
(2) The SMT can reduce the number of drilling holes on the printed board and save the repair cost;
(3) Cost down of circuit debugging due to the improvement of frequency characteristics;
(4) Because of the small size and lightweight of the chip components, the cost of packaging, transportation, and storage is reduced;
SMT chip processing technology can save material, energy, equipment, manpower, time, and so on, and can reduce the cost by 30%~50%.
Full Automatic Press
Printing accuracy + 0.025 mm
Repeatability accuracy + 0.01 mm
Minimum steel mesh size 470*380 mm
Maximum steel mesh size 737*737 mm
Platform tuning range X: + 4 mm, Y: + 6 mm
The adjustment angle of the platform is 2 degrees
The minimum size of veneer 50*50 mm
The maximum size of single-board 610*600 mm
PCB thickness 0.4-5 mm
PCB weight 0-3 kg
Solder paste inspection comes with a 2 D online inspection
Squeegee pressure 1-10 KG
FUJI placement machine
Swivel head, 12 suction nozzles
Minimum mount 01005
Patch PCB thickness 0.3-6.5 mm
Patch max size PCB 686*508 mm
Minimum size PCB 50*100 mm
The soft board can be affixed with rigid board
Paste BGA minimum package 0.4 mm
Patch accuracy is minimum, normal component accuracy is + 0.04 mm, IC class, patch accuracy is + 0.03 mm
Mount speed 25000 points/hour
1, Resistance or capacitance class component is 0.3% (batch index).
2, The IC class device is without throwing material.
10 temperature zone reflux furnace in the warm zone
Over the PCBA plate, the maximum size is unlimited, width 50-420mm
The range of temperature control – room temperature – 300 degrees
Temperature control accuracy + 1%
PCB plate temperature distribution deviation is + 1.5 degrees
Parameter reserve 80G
Conveying speed of reflow furnace 300-2000 mm/min
The cooling method, air cooling
Auxiliary equipped with self-heating furnace test system + furnace temperature tester
PCB board element height is 15 mm/ below 50 mm
Check resolution 20
Please contact us for more details if you need, or visit our HIEDESIGN for our design and services.