Highfive Rigid Flex Capabilities
Rigid Flex Capabilities can match your Prototypes and NPI, Pilot, Mix-production Based on Cheap Cost
Rigid flex capabilities are boards using a combination of flexible and rigid boards with technologies.
Most rigid-flex boards consist of multiple layers of flexible circuit substrates attached to one or more rigid boards externally and/or internally.
Depending upon the design of the application.
The flexible substrates are designed to be in a constant state of flex and are usually formed into the flexed curve during manufacturing or installation.
Rigid Flex capabilities and designs are more challenging than the designs of those typical rigid board applications, as the rigid-flex boards are designed in a 3D space.
Which also with greater spatial efficiency.
By being able to design in three dimensions rigid flex designers can twist, fold, and roll the flexible board to achieve their desired shape for the final application’s package.
Rigid Flex Capabilities Applications
Rigid-Flex PCBs offer a wide array of applications, ranging from smart devices to cell phones and digital cameras. Increasingly, rigid-flex board fabrication has been used in medical devices such as pacemakers for their space and weight reduction capabilities.
The same advantages for rigid-flex PCB usage can be applied to smart control systems.
In consumer products, rigid-flex doesn’t just maximize space and weight but greatly improves reliability,
eliminating many needs for solder joints and delicate, fragile wiring that are prone to connection issues.
These are just some examples, but Rigid-Flex Rigid flex capabilities can be used to benefit nearly all advanced electrical applications
including testing equipment, tools, and automobiles.
Rigid Flex Capabilities and Production Process
Whether producing a rigid flex prototype or production quantities requiring large scale Rigid-Flex PCBs fabrication and PCB assembly.
The technology is well proven and reliable. The flex PCB portion is particularly good in overcoming space and weight issues with spatial degrees of freedom.
Careful consideration of Rigid-Flex solutions and a proper assessment of the available options at the early stages in the rigid-flex PCB design phase will return significant benefits.
The Rigid-Flex PCBs fabricator must be involved early in the design process to ensure the design and fab portions are both in coordination and to account for final product variations.
The Rigid flex capabilities manufacturing phase is also more complex and time-consuming than rigid board fabrication.
All the flexible components of the Rigid Flex assembly have completely different handling, etching, and soldering processes than rigid FR4 boards.
Highfive Rigid Flex Capabilities Details
| Flex Layers (Not Including Rigid) | 2-4 | 6-8 | 10-12 |
| Flex layer Copper(OZ) | 0.5 | 1.0 | 1.0 |
| Registration Layer to Layer (MIL) | 3 | 3 | 3 |
| Flex Layer Dielectric Thickness(UM) | No glue 25 | No glue 25 | Glue 65 |
| Line Width/Line Space (MIL) | 3/3 | 3/3 | 3/3 |
| Laser Drilling Via Hole Diameter (MM) | 0.1 | 0.1 | 0.1 |
| Flex Area Width(MM) | 15 | 10 | 5 |
| Panel Size (MM) | 254*400 | 254*500 | 457*609 |
| Distance from VIA Hole to Board Edge (MM) | 3.0 | 2.0 | 1.0 |
| Distance from Component Hole to Board Edge (MM) | 3.0 | 2.5 | 2.0 |
| Min Distance from Trace to Outline (MIL) | 10 | 10 | 10 |
| Tooling Tolerance (MIL) | 2 | 2 | 2 |
| ZIF Tolerance (MIL) | 2 | 2 | 2 |
| Solder Mask Registration Tolerance(MIL) | 5 | 5 | 5 |
| Solder Mask Bridge (MIL) | 5 | 5 | 5 |
| Coverlay Registration Tolerance (MIL) | 8 | 8 | 8 |
| PIC Registration (MIL) | 7 | 7 | 7 |
| Solder Mask Registration (MIL) | 5 | 5 | 5 |
| PI Stiffener (MIL) | 10+/-10% | 10+/-10% | 10+/-10% |
| FR 4 Stiffener Tolerance (Layer to Layer) (MIL) | 5 | 5 | 5 |
| Outline Tolerance (MIL) | 5 | 5 | 5 |
| Min Radius (MIL) | 5 | 5 | 5 |
Highfive Rigid Flex Capabilities PCB why us
Benefits of Rigid Flex Capabilities
Space size can be minimized
By removing the connectors and cables between rigid parts
Then you can improve board size and overall system weight
By maximizing space usage but with few parts.
Few solder joints but with higher connection reliability.
The handling of assembly is easier in comparison with normal.
Simplified PCB assembly processes.
Integrated ZIF contacts provide simple modular interfaces to the system environment.
Test conditions are simplified. A complete test before installation becomes possible.
Logistical and assembly costs are significantly reduced with Rigid-Flex boards.
It is possible to increase the complexity of mechanical designs, which also improves the degree of freedom for optimized housing solutions.
Check Highfive Rigid-Flex PCB manufacturing capabilities in the following table:
Rigid Board Capacities of Construction
Minimum core thickness: 0.003″
Minimum prepreg: 0.002″
Mixed dielectrics
Controlled dielectrics
Controlled impedance
Impedance Layer Stack-up
Blind via, buried via
Silver Filled Via holes
Min. PCB thickness 0.010″
Max. PCB thickness 0.283″ (7.2mm)
Rigid Board Capabilities of Surface Finishing
HASL ( Hot Air Solder Leveling)
Immersion Silver
Immersion Gold
Soft Bondable Gold
Electrolytic Gold (Knoop Hardness 120 or <)
Soft Electrolytic Gold (Knoop Hardness 90 or <)
OSP (Organic Solderability Preservative)
Rigid Board Materials Processing
Via Hole Filled (Plated shut)
Via Hole Filled (CB100 Silver)
Rigid Capabilities for PCB Processes
1. Min Line Trace Width (Outer and Inner) 3 mil
2. Min Line Space (Outer and Inner) 3 mil
3. Max Layer Count 40
4. Min Hole Diameter 6 mil/ laser Drilling Hole Diameter 1mil
5. Min. HWTC (mil) 7 mil
6. Hole Location Dimension 2 mil
7. Fabrication Radius +/5 Degrees
8. Warpage/Inch 3 mil
9. Solder-mask Space 3 mil
10. NPTH Hole Size Tolerance 1 mil
11. Peel-able Testing 1.4N/mm
12. Max. Aspect Ratio 12:1
13. SMT Pitch/BGA Pitch (mil) 18 mil /12 mil
14. Plating Thickness (1).Plating Ni Thickness：2.5~5um.
(2).Plating Au Thickness：0.05~2um (per client)
15. Registration Layer-to-layer 2 mil
16. Impedance Control +/-7%(5%)
17. Blind & Buried Yes
18. HDI 3+N+3, N+N
19. Base Copper 1/3,…, 6 OZ, 4 OZ with UL
20. Copper Thickness (Outer) 5 OZ
21. Registration Layer to Layer 3 mil
22. Max Board thickness of 120 mil
23. Board Thickness Tolerance 5%
24. Lead-free HASL 2-5 um or Per customer requirements
25. ENIG 0.03-0.15um
26. Flash Gold 0.05-0.1 um
27. Thick Gold 0.1-2.0 um
28. Immersion Silver 0.1-0.5 um
29. Immersion Tin 0.8-1.2 um
30. OSP 0.1-0.5um,ENTEK
31. Selective Gold Plating Per customer requirements
32. Selective OSP/HASL Per customer requirements
Highfive Rigid Flex Capabilities PCB why us
You can get much more as you need from the Rigid-Flex PCB group or Please contact us for more details if you need them, or visit our HIEDESIGN for our creative and innovative ODM & OEM services.