Flexible Board
Flexible Board Capabilities
1. Flexible Board Material: Low Flow PP, PET., etc.
2. Build-up Material: PI Bond Ply, etc.
3. Layer Count: 10 or higher
4. Copper Foil: 1/3,…,2OZ,
5. Standard Panel Size: 250*400(mm)
6. Min. Line Width/Space: 3mil
7. Minimum Rilling (Mechanical ) Hole Diameter: 8 mil
8. Minimum Via (Laser) Hole Size Diameter: 5 mil
9. Minimum Micro Via (Laser) Hole Size Diameter: 3 mil
10. Stiffener Material: Polyimide/FR4/Metal
11. PI Stiffener Registration: 10 mil
12. PI Thickness Tolerance:10%
13. FR4 Stiffener Registration:10 mil
14. FR4 Thickness Tolerance: 10%
15. Shielding Material: Copper/Silver Ink/Tatsuta/Carbon
16. Tooling Tolerance: 2 mil
17. If Tolerance: 2 mil
18. Coverlay Registration: 8 mil
19. PIC Registration: 7 mil
20. Solder Mask Registration: 5 mil
21. Flexible Board Impedance Control: +/-10% & 7%
22. Flexible Board Max Aspect Ratio (Thr. Hole): 8:1
23. Flexible Board Min. SM Opening:2 mil
24: Solder Mask Bridge Between Dam: 5 mil
25. Solder Mask Registration Tolerance: 4 mil
26. Type of Surface Finish: OSP, Selective OSP, Flash Gold, Thick Gold
27. Legend Minimum Height: 35 mil
28. Legend Minimum Width: 8 mil
29. Legend Minimum Space: 8 mil
30. Legend Registration +/-5 mil
SRD( Steel Rule Die)
31. Outline Tolerance: 4 mil/ or 2 mil
32. Minimum Radius: 5 mil
33. Min side Inside Radius:20 mil
34. Punching Minimum Hole Size: 40 mil
35. Punching Hole Size Tolerance +/-2 mil
36. Slot Minimum Width: 20 mils, V-cut and Routing Tolerance: 6 mil
37.Tolerance for Hole Outline: +/-3 mil
38. Tolerance for Hole Edge :+/- 4 mil
39. Minimum the distance between Trace to Outline: 8 mil
There are some details for FPC which is relevant to Rigid Flex PCB you can contact us for more. Or you can join the Rigid-Flex Group to get much more.