Rigid Board Capabilities
Rigid board Capabilities for Material
Rogers, 4003, 4350, Rogers+FR-4 Hybrid
Nelco 4000 Series
Per IPC-4101
Multi-functional FR-4
FR-406, FR-408, IS410, 370HR
FR-4 Tg,Hi-Tg,Halogen-free,BT Epoxy,Teflons,
Arlon,Taconics,RCC,Cyanate Ester,Polyimide,
Nelcon,Getek,Allied 408,CEM3,ceramic,PTFE, etc.
Rigid Board Capacities of Construction
Minimum core thickness: 0.003″
* Minimum prepreg: 0.002″
* Mixed dielectrics
* Controlled dielectrics
* Controlled impedance
* Impedance Layer Stack-up
* Blind via, buried via
* Silver Filled Via holes
* Min. PCB thickness 0.010″
* Max. PCB thickness 0.283″ (7.2mm)
Rigid Board Capabilities of Surface Finishing
HASL ( Hot Air Solder Leveling)
Immersion Silver
Immersion Gold
Soft Bondable Gold
Electrolytic Gold (Knoop Hardness 120 or <)
Soft Electrolytic Gold (Knoop Hardness 90 or <)
OSP (Organic Solderability Preservative)
Highfive 8L Rigid Board ENIG Fine BGA PCB
Highfive 8L RIGID BOARD ENIG Fine BGA PCB
Rigid Board Materials Processing
Via Hole Filled (Plated shut)
Via Hole Filled (CB100 Silver)
Rigid Capabilities for PCB Processes
Highfive Multilayer PCB IoT Rigid Board Capabilities HDI
1. Min Line Trace Width (Outer and Inner) 3 mil
2. Min Line Space (Outer and Inner) 3 mil
3. Max Layer Count 40
4. Min Hole Diameter 6 mil
5. Min. HWTC (mil) 7 mil
6. Hole Location Dimension 2 mil
7. Fabrication Radius +/5 Degrees
8. Warpage/Inch 3 mil
9. Solder-mask Space 3 mil
10. NPTH Hole Size Tolerance 1 mil
11. Peel-able Testing 1.4N/mm
12. Max. Aspect Ratio 12:1
13. SMT Pitch/BGA Pitch (mil) 18 mil /12 mil
14. Plating Thickness (1).Plating Ni Thickness：2.5~5um.
(2).Plating Au Thickness：0.05~2um (per client)
15. Registration Layer-to-layer 2 mil
16. Impedance Control +/-7%(5%)
17. Blind & Buried Yes
18. HDI 3+N+3, N+N
19. Base Copper 1/3,…, 6 OZ, 4 OZ with UL
20. Copper Thickness (Outer) 5 OZ
21. Registration Layer to Layer 3 mil
22. Max Board Thickness of 120 mil
23. Board Thickness Tolerance 5%
24. Lead-free HASL 2-5 um or Per customer requirements
25. ENIG 0.03-0.15 um
26. Flash Gold 0.05-0.1 um
27. Thick Gold 0.1-2.0 um
28. Immersion Silver 0.1-0.5 um
29. Immersion Tin 0.8-1.2 um
30. OSP 0.1-0.5um,ENTEK
31. Selective Gold Plating Per customer requirements
32. Selective OSP/HASL Per customer requirements
Please contact us for more details if you need them, or visit our HIEDESIGN for our creative and innovative ODM & OEM services.