PCB Glossary

 

A. Overview of PCB Glossary 

Printed Circuit Board

Flexible Printed Circuit

FPC

Double-Side Printed Board

IPC（The Institute for Interconnecting and Packing Electronic Circuits）

CPAR（Corrective & Preventive Action Request）

Flammability Rate

Characteristic impedance

BUM（Build-up multilayer）

Date Code

CCL（Copper-clad laminate）

Ionic contamination

Acceptance Quality Level (AQL)

HDI（High density interconnecting）

Base Material

Radius

Capacity

Diameter

Capability

PPM(Parts Per Million)

CAM（computer-aided manufacturing)

Underwriters Laboratories Inc.

CAD (computer-aided design)

Statistical Process Control

Specification

Via

Dimension

Buried /blind via

Tolerance

Tooling hole

Oven

Output/throughput

Board cut

Carbon printing

Inner dry film

Peelable blue mask

Inner etching

ENIG(Electroless nickel immersion gold)

Inner dry film stripping

HAL(hot air leveling)

AOI （Automatic Optical Inspection）

OSP（Organic solderability preservative）

Pressing

Punching

Drilling

Profiling

Desmear

E-Test

PTH

FQC(final quality control)

Panel plating

FQA(Final quality audit)

Outer dry film

Packing

Etching

IPQA(In-process quality audit)

Tin stripping

IPQC(In-process quality control)

EQC（QC after etching）

IQC(Incoming quality control)

Solder mask

MRB(material review board)

Component mark

QA(Quality assurance)

Physical Laboratory

QC(Quality control)

Chemistry Laboratory

Document control center

2nd Drilling

Routing

Brown oxidation

Wastewater treatment

V-cut

WIP（work in process）

Store/stock

F.G(Finished goods)

 

B. Wet Processes PCB Glossary 

 

PTH（plated through hole）

Acid cleaning

PP(Panel Plating)

Acid dip

Pattern plating

Pre-dip

Line width

Alkaline cleaning

Spacing

Flux

Deburring

Hot air leveling

Carbon treatment

Skip plating

Track/conductor

Undercut

Aspect ratio

Water rinsing

Etch Factor

Transportation

Back Light Test

Rack

Pink ring

Maintenance

 

C. Dry Processes PCB Glossary 

Hole location

Annular ring

Image Transfer

Component Side(C/S)

Artwork

Solder Side(S/S)

Mylar

Matte Solder Mask

Silkscreen/legend/Component Mark

Hole breakout

Fiducial mark

Scrubbing

Expose

Developing

 

D. Inner Layer PCB Glossary 

 

Core material

Thermal pad

Pre-preg

Resin content

Kraft Paper

Brown oxidation

Lay up

Black Oxidation

Registration

Base material

Delamination

Wicking

Hole size

Yield

Touch Up

Warp and Twist

Solvent Test

Peel off

Company Logo

Tape Test

UL Mark

Cosmetic

Function

Tin/Lead Ratio

Reliability Tests

Hole Wall Roughness

Base Copper Thickness

 

E  General PCB  Glossary

1.PCB=Printed Circuit Board

2.CAM=Computer aided manufacture

3.Pad

4.Annular ring

5.AOI=automatic optical inspection

6.Charge of free

7.WIP=work in process

8.DCC=document control center

9.Legend

10.CS=Component Side =Top Side

11.SS=Solder Side =Bottom Side

12.Gold Plated

13.Nickel Plated

14.Immersion Gold

15.Carbon Ink Print

16.Microsection Report

17.X-out=Cross-out

18.Panel

19.Marking & UL

20.Date code

21.Unit

22.Profile & Outline

23.Profile by Routing

24.Wet Film

25.Slot

26.Base Material=Base Laminate

27.V-out =V-score

28.Finished

29.Marketing

30.Gerber File

31.UL LOGO

32.E-Test=Electric Open/Short Test

33.PO=Purchase Order

34.Tolerance

35.Rigid, Flexible Board

36.Board cut

37.Board baking

38.Drill

39.PTH=Plated Through Hole

40.Panel plating

41.Photo Image

42.Pattern plating

43.Etching

44.SM=Solder Mask

45.SR=Solder Resist

46.Gold finger

47.Silkscreen

48.HAL=HASL=Hot air(Solder)leveling

49.Routing

50.Punching

51.FOC=final quality checking

52.FOA=final quality audit

53.Shipping

54.Flux

55.Au,Cu,Ni,Pb,Tn,Tin-lead

56.Lead free

57.COC=compliance of certificate

58.Microsection=cross section

59.Chemical gold

60.Mould=punch die

61.MI=manufacture instruction

62.QA=quality assurance

63.CAD=computer aided design

64.Drill bit size

65.Bow and twist

66.Hit

67.Bonding

68.Test coupon

69.Thieving copper

70.Rail-web

71.Break-up tab

72.Break away tab

73.GND=ground

74.Hole edge

75.Stamp hole

76.Template

77.Dry film

78.LPI=liquid photo image

79.Multilayer

80.SMD=surface mounted device

81.SMT=surface mounted technology

82.Peelable mask=blue gel

83.Tooling hole

84.Fiducial mask

85.Copper foil

86.Dimension

87.Negative, positive

88.Flash gold

89.Engineering department

90.Delivery date

91.Beveling

92.Spacing=gap

 

 

 F. PCB Layer PCB  Glossary

1、TOP LAYER

2、BOMTTOM LAYER

3、TOP/BOTTOM SOLDER

4、TOP/BOTTOM PASTE

5、TOP/BOTTOM OVERLAY

6、MECHANICAL LAYERS

7、KEEPOUT LAYER

8、MIDLAYERS

9、INTERNAL PLANES

10、MULTI LAYER

11、DRILL GUIDE

12、DRILL DRAWING

 

 

Detail PCB Glossary

A  a

A.O.I(Automatic Optical Inspection)

Acceptable quality level (AQL)

Accuracy

Activating

Active carbon treatment

After Pressed Thickness

Alignment

Annular ring

Anti-Static Bag

Apparatus

Area

Artwork

Artwork Drawing

Artwork Film

Artwork Modification

Artwork No.

Assembly

Axis

 

B  b

Backplane

Back-up

Baking

Ball Grid Array (BGA)

Bare board

Base Copper

Base material

Beveling

Black Oxide

Blind via-hole

Blistering

Board Cutting

Board Thickness

Bottom side

Breakaway tab

Brushing

Build-up

Bullet pad

Buried hole

C  c

C/M(Component Marking)

Carbon ink

Carrier

Ceramic substrate

Certificate of Compliance

Chamfer

Chemical cleaning

Chemical corrosion

Chip Scale Package (CSP)

Circuit

Clearance

Color

Component Side(C/S)

Composite layers

Computer-Aided Design (CAD)

Computer-Aided Manufacturing (CAM)

Computer Numerical Control (CNC)

Conductor

Conductor width/space

Contact

Copper area

Copper clad

Copper foil

Copper plating

Corner

Corner mark

Corner REG.Hole

Cracking

Creasing

Criteria

Crossection area

Cu/Sn Plating

Current efficiency

Customer

Customer Drilling File

Customer P/N

 

D  d

D/F Registration Hole

D/F(Dry Film)

Date Code

Datum hole

Daughterboard

Deburring

Defect

Definition

Delamination

Delay

Delivery

Densitometer

Density

Department

Description

Design origin

Desmear

Desiccant

Developer

Diamond

Diazo film

Dielectric breakdown

Dielectric constant

Dielectric Thickness

Dielectric Voltage Test

Dimension

Dimensional stability

Direct/indirect

Distribution

Document type

Documentation Control

Double-sided board

Drill bit

Drilling

Drilling Roughness

Dry Film

Dry Film-Pattern

Dynamic

 

E  e

ECN(Engineering Change Notification)

Effective date

Electrical Test Fixture

Electromigration

Electro conductive paste

Electroless

Electroless copper

Electroless Ni

Electroless Gold/Au

Engineering drawing

Entek

Epoxy glass substrate

Epoxy resin

Etch

Hatchback

Etching

E-Test Marking

E-Test(Electrical Test)

Exposure

External layer

 

F  f

Fiducial mark

Filling

Film Fabrication

Final QC

Finish Overall Board Thickness

Fixture

Flammability

Flash Gold

Flexible

Flux

 

G  g

General information

Ghost image

Glass transition temperature

Gold Finger(G/F)

Golden board

Grid

Ground plane

 

H  h

HAL(Hot Air Leveling)

Hand Rout

Hardness

Heat Sealed

Heat Shrink-warp

Holding time

Hole

Hole breakout

Hole density

Hole Diameter

Hole location

Hole Location Chart

Hole Position Tolerance

Hole size

Hot Air Leveling(HAL)

Humidity

 

I   i

Identification

Image

Imaging transfer

Impedance

Impedance Test

Inner copper foil

Inspection

Insulation resistance Test

Inter Plane Separation

Interleave Paper

Internal layer

Internal stress

Ionic cleanliness

Isolation

Isolation Resistance

Item

 

K   k

KEY board

Key slot

Kraft paper

 

L    l

Laminate

Laminate Thickness

Lamination void

Landless hole

Laser plotter

Laser plotting

Laser via-hole

Layup

Lay-up Instruction

Legend

Legend Width

Length

Lifted Lands

Line Width

Liquid

Location

Logic diagram

Logo

Lot size

 

M   m

Mark

Master drawing

Material Thickness

Material Type

Max. X-out

Max.Board Thickness After Plating

Measling

Mech Drawing No.

Mechanical cleaning

Metal

Method

MI(Manufacturing Instruction)

Microstrip

Min Conductor Copper Thickness

Min Hole Wall Copper Thickness

Min. Gold Plating Thickness

Min. Nickel Thickness

Min. Tin-Lead Thickness (After HAL)

Min. Annular Ring

Min. Spacing between Line to Line

Min. Spacing between Line to Pad

Min. Spacing between Pad to Pad

Minimum

Mirroring

Missing

Model No.

Molded

Motherboard

Molding

Mounting hole

Multilayer

Multi-layer Laminate

 

N  n

Negative

Netlist

Network

Nick

No. of holes

No.of Array/Panel

No.of Panel per Stack

No.of Panel/Sheet

No.of Pcs Per Bag

No.of Unit/Array

Normal value

 

O  o

Oblong

Offset

Open/short

Optimization(design)

Organic Solderability Preservatives(OSP)

Originator

Outer copper foil

Outline

 

P   p

Packing

Pad

Panel Area

Panel Plated Crack

Panel plating

Panel Size

Panel Size After Outer layer Cutting

Panel Utilization

Pass rate

Passivation

Pattern

Pattern Inspection

Pattern plating

PCB(Printed Circuit Board)

Peck drilling

Peel strength

Peelable

Peelable

Peelable Mask

Peeling

Permanent

PH value

Photo plotting

Photo via-hole

Photographers

Photoplotler

Physical

Pinhole

Pink ring

Pinning hole

Pitch

Placement

Plated Through Hole(PTH)

Plating

Plating Crack

Plating line

Plating rack

Plating Void

Plug Hole

Polymer

Porosity

Positive

Power plane

Prepreg

Primary side

Print

Probe point

Process

Process flow

Product Planning Dept.

Production

Profile

Profiling

Profiling Process

Project No.

PTH Thermal Stress Test

PTH(Plating Through Hole)

Pull away

Punch

Punching

Punching Mould Drawing

 

Q   q

QA Audit

QA(Quality Assurance)

Quad Palt Pack (QFP)

Quality

Quantity

R  r

Raw Material Utilization

Recall

Rectifier

Register mark

Registration

Remark

Resin

Resin Recession

Resist

Resolution

Rigid

Roller coating

Roughening

Round pad

Routing

 

S   s

S/M Material

S/M(Solder Mask)

Sales

Sample

Sampling inspection

Scaling factor

Scope

Scoring

Scratch

Secondary side

Section Code

Section Code Change

Segment

Separated

Sequence

Sets

Sheet Size

Schematic diagram

Shiny

Silkscreen

Silver film

Single/double

Slot

Smear

Solder Mask

Solder mask on bare copper

Solder side

Solder Side C/M

Solder Side Cir.

Solder Side Circuit

Solder Side S/M

Solderability

Solvent Test

Spacing

Special requirement

Specification

Spindle

Split

Square pad

Standard

Static

Stencil

Step drilling

Step scale

Store

Supplier

Supported hole

Surface

Surface mount technology

Swimming

 

T  t

Tack

Tape Programming

Tape Test

Target Hole

Teardrop

Template

Tenting

Test

Test coupon

Test Parameter

Test Pattern

Testing Voltage

Thermal shock

Thermal stress

Thickness

Tin Content

Tin/Lead Stripping

Tin-lead plating

Tolerance

Topside

Touch up

Training

Transmission

Transmittance

Trim line

 

U   u

Ultrasonic cleaning

Undercut

Unit Arrangement

Unit Layout Per Panel

UV-blocking

 

V   v

Vacuum Pack

Vacuum lamination

V-Cut

View From…

Visual & Warpage

Visual inspection

Voltage

 

W  w

W/F(Wet Film)

Warp & Twist

Width

Wiring

 

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